Powering the Future: Indium Corporation to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China. The presentation, titled Next-Gen Advanced Packaging Materials and System Integration for Power Electronics, examines how advanced interconnection materials and process innovations work together to improve yield, reliability, and manufacturability in next-generation semiconductor &#8230; <a href="https://www.eejournal.com/industry_news/powering-the-future-indium-corporation-to-present-next-gen-semiconductor-packaging-solutions-at-pcim-asia/" class="more-link">Read More &#8594;<span class="screen-reader-text"> "Powering the Future: Indium Corporation to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia"</span></a>