Inside Intel’s ‘Fan-out Fabric’ in ‘Diamond Rapids,’ Its Seventh-Gen Xeon Chip
<p>This week at Hot Chips, Intel shared more details of its upcoming seventh-generation Xeon chip, codenamed “Diamond Rapids,” which will utilize a chiplet-based SoC architecture that features a large amount of disaggregated compute placed around a centralized I/O and memory fabric, which Intel dubbed its “Fan-out Fabric Architecture.” The Fan-out Fabric Architecture marks a departure […]</p>
<p>The post <a href="https://www.hpcwire.com/2026/08/25/inside-intels-fan-out-fabric-in-diamond-rapids-its-seventh-gen-xeon-chip/">Inside Intel’s ‘Fan-out Fabric’ in ‘Diamond Rapids,’ Its Seventh-Gen Xeon Chip</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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