TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The report, cited by <em>Wccftech</em>, attributed the shift to TSMC's rising capacity amid expanding industry-wide demand.
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