AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most of the planned capacity has already been booked, as the Taiwan-based OSAT supplier builds a second growth engine around advanced packaging and optical integration.
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