SK Hynix starts construction of first HBM chip packaging plant in US
Nikkei Asia · August 27, 2026
SK Hynix to start AI chip volume production in Indiana in 2029
Singapore News · August 27, 2026
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility
SK Hynix to start AI chip output in Indiana in 2029, sees memory shortage through 2030