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Digitimes August 28, 2026 By Levi Li positive

AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

AI / LLMSemiconductors
<p class="P1" data-start="99" data-end="335">The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest outsourced semiconductor assembly and test (OSAT) providers preparing a fresh round of capacity expansion.
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