Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA)
<p>Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.” Abstract Excerpt: The paper presents an “open-source suite of 3D-IC benchmark testcases” and provides “reusable virtual chiplet models covering compute, memory, I/O, analog, and substrate components.” Find the technical paper here. August 2026. Soni, Rohan, Jooyeon... <a class="read_more" href="https://semiengineering.com/open-source-benchmark-suite-for-2-5d-3d-heterogeneous-integration-research-in-physical-design-ucla/">» read more</a></p>
<p>The post <a href="https://semiengineering.com/open-source-benchmark-suite-for-2-5d-3d-heterogeneous-integration-research-in-physical-design-ucla/">Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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