Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)

<p>Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.” Abstract Excerpt: The paper presents “a physics-guided generative design framework for liquid cooling channel topology optimization” in a “2.7 kW multi-chip package containing two high power GPUs and one CPU.”... <a class="read_more" href="https://semiengineering.com/generative-design-optimizes-liquid-cooling-channels-for-2-5d-and-3d-packages-um-dearborn/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/generative-design-optimizes-liquid-cooling-channels-for-2-5d-and-3d-packages-um-dearborn/">Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>