USI advances optical interconnect push with ELSFP laser module

Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds a controlling stake, has launched its ultra-high-power (UHP) external laser source form-factor pluggable (ELSFP) module series, targeting high-speed optical interconnect demand in next-generation AI compute clusters, high-performance computing (HPC), and high-density data centers, with mass production scheduled for the first quarter of 2027.