SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap
<p>SK Hynix’s $4B Indiana HBM fab aims to plug America’s AI chip packaging hole and build a Purdue-backed supply chain by 2029.</p>
<p>The post <a href="https://www.eetimes.com/sk-hynixs-4b-hbm-project-targets-u-s-chipmaking-gap/">SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
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