Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with a smart-factory solution combining automated material handling systems (AMHS), overhead hoist transport (OHT), and AI-powered digital twins, allowing packaging and testing facilities to automate without extensive reconstruction.
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