Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation optical communications. Taiwan's Ligitek Electronics and Liverage Technology are working with the Industrial Technology Research Institute (ITRI) and Dutch photonic chip packaging specialist Phix on a cross-border silicon photonics program targeting phased milestones of 1.6T DR8 by the end of 2026 and 3.2T product development by the end of 2027.
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