BenQ Materials targets CPO in semiconductor push

BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move into wafer manufacturing, back-end packaging, and co-packaged optics (CPO). With chemical mechanical planarization (CMP) cleaning brush rollers and wafer dicing tape already shipping, the group views 2026 as a new starting point for its semiconductor business, with more visible growth expected from 2027.