Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across the broader semiconductor equipment supply chain. Highlighting the trend at SEMICON Taiwan 2026, Hiwin Mikrosystem, in collaboration with the Hiwin Group, unveiled its next-generation precision positioning platform for SiPh inspection. Spurred by accelerating market adoption, order visibility for the platform now extends into the second quarter of 2027.