89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

<p class="P1" data-sourcepos="7:1-7:467;204-670">AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past US$1 trillion in 2026, four years earlier than previously expected, and expand the market to US$1.5 trillion by 2030. SEMI Global Chief Marketing Officer Terry Tsao said nearly 89 fabs are in the planning or construction pipeline for 2026-2030 to meet surging AI chip demand, with another 50 fabs expected to be planned for 2030-2035.