PCB material shortages intensify as AI infrastructure absorbs laminate capacity
While the semiconductor supply chain has dominated industry attention in recent years, a parallel bottleneck has been building in PCB base materials. AI data centre expansion is absorbing large quantities of high-grade laminates, leaving less capacity available for traditional industrial and automotive applications, according to a joint market analysis by STARTEAM GLOBAL and Würth Elektronik.
Read original article ↗
Related Articles
C-Band Transition Acceleration Service Now Powers Transition Program using the Media Substrate
The transition program NetActuate announced at NAB now runs on the transport layer launching at IBC 2026. Broadcasters l
Samsung, ASML expand partnership to introduce next-gen lithography by 2028
Samsung Electronics and semiconductor equipment giant ASML announced Tuesday that they will expand their strategic partn
POSCO union warns of 1st strike as wage talks falter
POSCO faces its first strike in its 58-year history as wage talks with its union remain deadlocked, with the latter thre