Chip Industry Technical Paper Roundup: Sept. 8
<p>HBF for LLM inference; M3D SRAM with BEOL pass-gates at 2nm; distributed GPU architectures; hybrid HBM-HBF memory; GaN-on-silicon polarization superjunctions; programmable silicon photonics; Al dopant activation in 4H-SiC.</p>
<p>The post <a href="https://semiengineering.com/chip-industry-technical-paper-roundup-sept-8-2/">Chip Industry Technical Paper Roundup: Sept. 8</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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