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HPC Wire September 8, 2026 By Andrew Jolly neutral

Qualcomm and AWS Collaborate on AI Inference Chips and 1.6T Connectivity

QualcommAmazonAWSAI / LLMSemiconductorsData Center
<p>SAN DIEGO, Sept. 8, 2026 &#8212; Qualcomm Technologies, Inc. today announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference. In addition, the companies are working on optical connectivity solutions extending up to 1.6T and future-generation solutions. As AI workloads grow exponentially — [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/qualcomm-and-aws-collaborate-on-ai-inference-chips-and-1-6t-connectivity/">Qualcomm and AWS Collaborate on AI Inference Chips and 1.6T Connectivity</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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