HBM’s Second Act: When Memory Starts Thinking

<p>Samsung’s <a href="https://hc2026.hotchips.org/">Hot Chips 2026</a> presentation, “HBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,” argues that the base die beneath a High Bandwidth Memory stack is about to become far more than a communications layer. Traditionally, an HBM base die mainly connects stacked DRAM dies to a GPU, TPU, or other processor and &#8230; <a href="https://semiwiki.com/events/372843-372843/" class="read-more">Read More </a></p> <p>The post <a href="https://semiwiki.com/events/372843-372843/">HBM’s Second Act: When Memory Starts Thinking</a> appeared first on <a href="https://semiwiki.com">SemiWiki</a>.</p>