SDC, LGD target advanced glass packaging

As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South Korean panel makers have turned their attention toward glass substrates and advanced packaging, their overall strategy remains exploratory. Compared to rivals in Taiwan and China, South Korea's leading players face a double-edged sword: their parent conglomerates already maintain established semiconductor and packaging divisions, a structure that enables cross-technology synergy but can also constrain new business expansion.