Samsung Electro-Mechanics showcases next-generation AI chip substrates

As artificial intelligence pushes chips toward greater speed and density, Samsung Electro-Mechanics is betting that the next battleground will be beneath them, where increasingly sophisticated package substrates carry signals, power and heat. The company is showcasing five types of next-generation semiconductor package substrates at KPCA Show 2026, which runs Wednesday through Friday at Songdo Convensia in Incheon. The lineup includes 2.5D and 2.1D package substrates, glass substrates, automotive FCBGA substrates and Ultra Thin Chip Scale Package (UTCSP) substrates. The technologies are designed for applications ranging from AI accelerators and servers to data centers, mobile devices and autonomous vehicles. For AI accelerators, Samsung Electro-Mechanics is demonstrating large, multilayer substrates designed to reduce warping while supporting high-speed signals, dense circuitry and large numbers of bumps. The company is also presenting 2.1D technology that connects semiconductor chips directly without a silicon interposer, using fine circuitry and high-density connections. Glass substrates