Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates are steadily shifting from technology validation to mass production. Spirox chairman Peter Chin said the company has entered advanced packaging inspection with nonlinear optical technology, with TGV aperture sizes now at 4μm and 3μm still under validation, while materials, foundry, memory and packaging companies in Taiwan, Japan, the US and South Korea have already sent samples for testing.
Read original article ↗
Related Articles
Korea Investment & Securities expands global ties with Fidelity, PIMCO, Carlyle
Korea Investment & Securities (KIS) has entered into a series of strategic partnerships earlier this week with global as
SINGAPORE, Sept. 10, 2026 /PRNewswire/ -- DeepCtrls recently completed a new Series B+ financing round, led by CATL, wit
Europe Today: Drone nearly hits Zelensky's plane as Riga debates Russia threat
A drone nearly hit Zelenskyy's plane en route to Norway's royal funeral, hours after Putin played down any Russian threa
China Bound • Beijing' English-language smart travel platform launched
BEIJING, Sept. 10, 2026 /PRNewswire/ -- A news report from chinadaily.com.cn: On Sept 9, China Daily and the Beijing Mun