CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap
<p class="P1" data-start="92" data-end="358">China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.
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