Taiyo Holdings Launches Next-generation Semiconductor Packaging Material “FPIM Series”

<p>Taiyo Holdings Co., Ltd., based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series", a next-generation semiconductor-packaging material.</p> <p>The post <a href="https://www.semiconductor-digest.com/taiyo-holdings-launches-next-generation-semiconductor-packaging-material-fpim-series/">Taiyo Holdings Launches Next-generation Semiconductor Packaging Material &#8220;FPIM Series&#8221;</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>