Samsung Electro-Mechanics Showcases Next-Generation Semiconductor Package Substrate Technologies for AI and Servers at ‘KPCA Show 2026’
<p>Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, where it will showcase next-generation semiconductor package substrate technologies.</p>
<p>The post <a href="https://www.semiconductor-digest.com/samsung-electro-mechanics-showcases-next-generation-semiconductor-package-substrate-technologies-for-ai-and-servers-at-kpca-show-2026/">Samsung Electro-Mechanics Showcases Next-Generation Semiconductor Package Substrate Technologies for AI and Servers at ‘KPCA Show 2026’</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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