Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)
<p>Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect... <a class="read_more" href="https://semiengineering.com/modeling-predicts-cure-and-thermal-endurance-of-advanced-packaging-underfill-nist-ucsd-et-al/">» read more</a></p>
<p>The post <a href="https://semiengineering.com/modeling-predicts-cure-and-thermal-endurance-of-advanced-packaging-underfill-nist-ucsd-et-al/">Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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