Alchip Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026

<p>Highlights 3nm Production, 2nm Design, 3DIC Capabilities and Multi-Die Advanced Packaging SAN JOSE, Calif., Sept. 14, 2026 &#8212; Alchip Technologies will showcase its leading-edge process technology and advanced packaging achievements in Booth 1705 at AI Infra Summit 2026. The event runs from September 15 through September 17 at the Santa Clara Convention Center in Santa [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/alchip-showcases-advanced-asic-design-and-packaging-at-ai-infra-summit-2026/">Alchip Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>