Open App →
Back to News Feed
Korea Times September 15, 2026 By gyulee@koreatimes.co.kr(KoreaTimes) positive

Samsung SDS joins Anthropic's Claude Partner Network as Select-tier partner

SamsungAnthropicAmazonAWSAI / LLMSemiconductorsSupply Chain
Samsung SDS has become the first Korean company to earn Select-tier status in Anthropic’s Claude Partner Network (CPN), strengthening its ability to help businesses adopt and operate Claude-based artificial intelligence (AI) services. The designation comes about two months after the company signed a strategic partnership with the U.S. firm in July at an AI summit in San Francisco to expand enterprise AI business opportunities in Korea. The CPN’s Select tier recognizes partners with certified technical expertise and experience deploying Claude-based solutions in customers’ production environments. Samsung SDS said the new status strengthens its end-to-end AI adoption framework, covering consulting on Claude deployment, access to the model through Amazon Web Services’ (AWS) Amazon Bedrock platform, service implementation and operations and ongoing technical support. “By combining Anthropic's frontier AI technology with Samsung SDS's digital transformation expertise across industries, we will accelerate domestic companies’ AI adoption and help create tangible business value,”
Read original article ↗

Related Articles

Global X debuts ETF targeting key MLCC manufacturers

Global X, the New York-based provider of exchange-traded funds (ETFs), announced Tuesday the launch of a new fund that s

Korea Times · September 15, 2026

EUCLYD Raises Over €200 Million to Break the AI Efficiency Wall

Financing accelerates development of ultra-efficient infrastructure for foundation AI models EINDHOVEN, Netherlands, Sep

PR Newswire · September 15, 2026

EUCLYD Raises Over €200 Million to Break the AI Efficiency Wall

Financing accelerates development of ultra-efficient infrastructure for foundation AI models EINDHOVEN, Netherlands, Sep

PR Newswire · September 15, 2026

TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity

TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes

Digitimes · September 15, 2026