Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

<p class="P1" data-start="1945" data-end="2512">The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory. Within weeks, SK Hynix has been reported to be weighing Intel alongside TSMC, Samsung Electronics has been reported to be pairing its own foundry with TSMC, and Micron has confirmed that TSMC will manufacture its next-generation base die. What began as a single-vendor arrangement is turning into a multi-front sourcing contest &mdash; and the assumption that a second source automatically means a cheaper one is already being challenged.