Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive focus for supply chains in the US, Japan, South Korea, Taiwan, and China. Players are now positioning themselves around four key steps — glass materials, via drilling, via metallization, and multilayer substrate lamination — to capture opportunities for 2027 and 2028.
Read original article ↗
Related Articles
Market Logic Software Launches DeepSights Radar, an AI Early-Warning System for Market Change
New agentic AI capability continuously monitors selected industries and topics, giving business leaders a current view o
TestMu AI lanza el ciclo de vida de aseguramiento en Kane CLI
-TestMu AI lanza el ciclo de vida de aseguramiento en Kane CLI, transformando documentos de requisitos en cobertura de p
COPENHAGUE, Dinamarca, 16 de septiembre de 2026 /PRNewswire/ -- Configit, líder mundial en gestión del ciclo de vida de
Stella Artois debuts Pure Gold premium lager in Korea
Stella Artois is introducing Pure Gold, a new premium lager in Korea that combines zero sugar and zero gluten with a low