Open App →
Back to News Feed
Digitimes September 17, 2026 By Scarlett Yu neutral

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

IntelMediaTekGoogleManufacturingSupply Chain
Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek. MediaTek has also stated during an earnings call that EMIB-T yields have reached levels capable of supporting stable mass production, expressing confidence in the project's 2027 production plans.
Read original article ↗

Related Articles

SK Hynix reportedly eyes Intel Ohio plant for US memory production

SK Hynix is reportedly lining up US memory chip production and is in talks with Intel over possible cooperation, includi

Digitimes · September 17, 2026

Snap is launching a new Specs AI tool, and it’s coming to iOS and Mac

Snap is introducing "Specs Intelligence," a new AI assistant that can connect other digital accounts to help you with th

The Verge · September 16, 2026