NovoLINC Launches MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips

<p>PITTSBURGH, Sept. 17, 2026 /PRNewswire/ -- NovoLINC, an innovator in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the launch of MaxLINC, a new generation of thermal interface material engineered for the rapidly increasing power and...</p>