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Semiconductor Engineering September 19, 2026 By Technical Paper Link neutral

Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)

AI / LLMSemiconductorsManufacturing
<p>Researchers at the University of Michigan published a technical paper titled “Fengshui: Demystifying Chiplet Ecosystem and Bespoke Neural Network Accelerator Codesign.” Abstract Excerpt: “This paper introduces Fengshui, a chiplet ecosystem and accelerator co-design framework that jointly optimizes chiplet pool composition and bespoke application-specific integrated circuit (BASIC) design.” Find the technical paper here. September 2026. Jin,... <a class="read_more" href="https://semiengineering.com/chiplet-co-design-framework-reduces-energy-and-design-costs-for-ai-accelerators-university-of-michigan/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/chiplet-co-design-framework-reduces-energy-and-design-costs-for-ai-accelerators-university-of-michigan/">Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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