Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)

<p>Researchers at the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published a technical paper titled “IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning.” Abstract Excerpt: “We introduce IC-ThermBench, an open and progressive benchmark that combines established 3D-IC steady-state, transient, and industrial package tasks with a new 50,000-sample 2.5D chiplet... <a class="read_more" href="https://semiengineering.com/open-benchmark-evaluates-ai-thermal-models-for-2-5d-and-3d-ics-uts-tu-munich-shanghaitech/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/open-benchmark-evaluates-ai-thermal-models-for-2-5d-and-3d-ics-uts-tu-munich-shanghaitech/">Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>