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HPC Wire July 27, 2026 By Andrew Jolly positive

Synopsys Advances Agentic AI Chip Design with AMD and Microsoft

AMDMicrosoftSynopsysAI / LLMSemiconductorsData Center
<p>SUNNYVALE, Calif., July 27, 2026 &#8212; Synopsys, Inc. has announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. AI is fundamentally reshaping engineering, and Synopsys is building a comprehensive, open agentic AI stack to increase engineering autonomy and accelerate product design from silicon [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/synopsys-advances-agentic-ai-chip-design-with-amd-and-microsoft/">Synopsys Advances Agentic AI Chip Design with AMD and Microsoft</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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