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HPC Wire September 22, 2026 By Andrew Jolly positive

Berkeley Lab Combines Imaging and Simulation to Probe Ultrathin Semiconductors

AI / LLMSemiconductorsData Center
<p>Sept. 22, 2026 &#8212; A team of researchers led by the U.S. Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) developed a powerful new approach that enabled them to directly observe how electrons interact with defects in advanced semiconductor devices with an unprecedented level of detail. Their methodology included an innovative simulation tool that enabled accurate [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/berkeley-lab-combines-imaging-and-simulation-to-probe-ultrathin-semiconductors/">Berkeley Lab Combines Imaging and Simulation to Probe Ultrathin Semiconductors</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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