Taiwan breaks ground on advanced packaging industrial park
TSMC, the world’s largest contract chipmaker, will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.
Read original article ↗
Related Articles
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L
Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows proces
DRAM makers may potentially get more money for their wafers than TSMC gets for its N3 wafers.
TSMC anchors Kaohsiung's Baipu Park as ASE expansion spurs phase-two development
Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Ind
Kaohsiung's new industrial park targets advanced packaging suppliers for the post-Moore era
Baipu Industrial Park, located on the border of Kaohsiung's Gangshan and Ciaotou districts, broke ground on September 21