Digitimes September 24, 2026 By Lily Hess negative

Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC

QualcommAI / LLMMemory

Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris Patrick said the new package still falls under existing Package on Package (PoP) technology, but the memory is no longer stacked directly above the die and is shifted to the side to create a thermal path.

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