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Evertiq September 24, 2026 positive

ASML, TSMC to advance transition to large-format EUV photomasks

TSMCASMLAI / LLMSemiconductorsManufacturingSupply Chain
While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.
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