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Semiconductor Digest September 24, 2026 By Shannon Davis neutral

ACCM Expands US Manufacturing Capacity Across Four Advanced Materials Segments for AI Infrastructure

AI / LLMSemiconductorsManufacturingData Center
<p>ACCM's Wisconsin facility will bring online laminate capacity of 20 million square feet per year in January 2027, with build-up and prepreg capacity of 87 million square feet per year online in November 2026.</p> <p>The post <a href="https://www.semiconductor-digest.com/accm-expands-us-manufacturing-capacity-across-four-advanced-materials-segments-for-ai-infrastructure/">ACCM Expands US Manufacturing Capacity Across Four Advanced Materials Segments for AI Infrastructure</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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