HANMI Semiconductor Ships First ‘FC Bonder 75’ for AI System Semiconductors

<p>HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High Bandwidth Memory (HBM) into system semiconductor packaging.</p> <p>The post <a href="https://www.semiconductor-digest.com/hanmi-semiconductor-ships-first-fc-bonder-75-for-ai-system-semiconductors/">HANMI Semiconductor Ships First &#8216;FC Bonder 75&#8217; for AI System Semiconductors</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>