Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with <em>DIGITIMES</em>, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.
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