Semiconductor Engineering September 29, 2026 By Linda Christensen neutral

Chip Industry Technical Paper Roundup: Sept. 29

AI / LLMSemiconductorsNVIDIA / GPUMemoryData Center

<p>A7 CFET vs. A10 NSFETs; wafer-scale sub-5nm MoS₂ transistors; multi-kW power delivery for 3D HI; copper microstructure and TSV residual stress; Rowhammer attacks on GPUs; gate-level RTL Trojan localization; concurrent HBM and host-memory access for LLM inference; agent-driven chip design using HLS.</p> <p>The post <a href="https://semiengineering.com/chip-industry-technical-paper-roundup-sept-29/">Chip Industry Technical Paper Roundup: Sept. 29</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>

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Chip Industry Technical Paper Roundup: Sept. 29

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