Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs
Intel has showcased a patent it filed in 2022 to embed MicroLEDs inside chip packaging. The company suggests this could be used for diagnostic testing, customized lighting on chip surfaces, but perhaps more importantly, an alternative integration for co-packaged optics
Read original article ↗
Related Articles
With the Hyland Content Innovation Cloud, enterprises are able to activate their unstructured data and turn this into co
With the Hyland Content Innovation Cloud, enterprises are able to activate their unstructured data and turn this into co
Facteus Consumer Transaction Intelligence Now Available on the Bloomberg Terminal
Facteus expands US consumer transaction intelligence available to users, providing ticker-level signals to corroborate s
Intel is prepping Core Ultra 400-series 'Nova Lake' platform launches as CPUs and chipsets pass interoperability and com