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HPC Wire September 29, 2026 By Andrew Jolly positive

SEMIFIVE Signs $52M AI Chip Development Deal with US Company

AI / LLMSemiconductorsData Center
<p>SEOUL, South Korea, Sept. 29, 2026 &#8212; SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has signed a contract worth approximately KRW 70.3 billion (~US$52 million) with a U.S.-based AI fabless company to develop a next-generation AI inference accelerator. The project marks SEMIFIVE&#8217;s first &#8220;Spec Hand-off&#8221; engagement in [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/semifive-signs-52m-ai-chip-development-deal-with-us-company/">SEMIFIVE Signs $52M AI Chip Development Deal with US Company</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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