Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026, the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates. The approximately 95,000-square-meter plant in the Jurong Lake District is the Toppan Group's first such facility outside Japan and is targeting the start of high-value manufacturing by late 2026, the companies said.