Open App →
Back to News Feed
Korea Times October 1, 2026 By aoshima11@koreatimes.co.kr(KoreaTimes) positive

Yongin national chip cluster construction begins this month amid compensation, fast-track risks

SamsungAI / LLMSemiconductorsMemorySupply ChainData Center
YONGIN, Gyeonggi Province — Korea’s ambitious plan to expand domestic semiconductor production capacity and strengthen its position in the global chip supply chain will take another step forward this month, as construction is set to begin on the Yongin Semiconductor Cluster National Industrial Complex in Gyeonggi Province this month. The initiative, however, is not free from possible delays, including compensation for residents and businesses already at the site and pressure to meet fast-track construction deadlines ordered by President Lee Jae Myung, who is determined to capitalize on soaring artificial intelligence (AI)-driven memory demand before it cools. Two semiconductor clusters are currently planned in Yongin’s Cheoin District. One is the Yongin Semiconductor Cluster General Industrial Complex, where SK hynix is already building its memory chip fabs, and the other is the Yongin System Semiconductor Cluster National Industrial Complex, which is set to break ground this month and will house Samsung Electronics’ foundry and memory fabs. The Korea Land & Housing Corp. (LH),
Read original article ↗

Related Articles

Samsung raises Galaxy S26 prices in South Korea seven months after launch

Under pressure from rising memory prices, Samsung Electronics has raised the South Korean launch prices of its Galaxy S2

Digitimes · October 1, 2026

BOE eyes closer ties with Samsung, LG as it pushes into chip packaging

China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands b

Digitimes · October 1, 2026

Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking

Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum

Digitimes · October 1, 2026

Qualcomm, Samsung redesign chip packaging as heat limits phone performance

Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising c

Digitimes · October 1, 2026