Applied Materials, Besi Expand Advanced Packaging Partnership for AI scaling

<p>Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in Singapore.</p> <p>The post <a href="https://www.semiconductor-digest.com/applied-materials-besi-expand-advanced-packaging-partnership-for-ai-scaling/">Applied Materials, Besi Expand Advanced Packaging Partnership for AI scaling</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>