Nanya Tech expands 3D OSAT to chase HBM-like demand

Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The company said it has won approval from the National Science and Technology Council's (NSTC) park review committee to set up a 3D wafer packaging and testing plant in Pingtung Science Park, aiming to capture demand for high-performance, high-bandwidth memory solutions driven by fast-growing AI applications.