Samsung and Broadcom Expand Collaboration Across Memory and Foundry Tech

<p>July 28, 2026 &#8212; Samsung Electronics and Broadcom have announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/samsung-and-broadcom-expand-collaboration-across-memory-and-foundry-tech/">Samsung and Broadcom Expand Collaboration Across Memory and Foundry Tech</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>